Starting with the CPUs, both the Ryzen 3 3100 and Ryzen 3 3300X are based on AMD’s 7nm Zen 2 die lithography and feature a 4-cores, 8-thread layout. In regards to clockspeeds, the Ryzen 3 3100 has a base and boost clock of 3.6GHz and 3.9GHz, while the Ryzen 3 3300X ships out at 3.8GHz and 4.3GHz. Lastly, both CPUs have a TDP of 65W and Total Cache of 18MB. Because the two Ryzen 3 CPUs are based on AMD’s Zen 2 CPU architecture, that also means that the two CPUs will also run on socket AM4 and that also explains the new B550 chipset. Like its more powerful brethren, the two CPU will also be able to take full advantage of the new PCIe 4.0 interface that was introduced with the launch of AMD’s more powerful 3rd generation Ryzen CPUs.
The AMD Ryzen 3 3100 and Ryzen 3 3300X will retail for RM449 and RM549, respectively. At the time of writing, AMD did not provide a specific launch date for Malaysia, but the global launch date is set for 21 May. On that note, the new B550 chipset motherboards are expected to be from 16 June onwards. (Source: AMD)
